Chips JU Chips For Europe Initiative Calls 2025 (CEI Calls)
Enriched Nordic · Found: 2026-03-11 08:06
The Chips for Europe Initiative (CEI) supports technological capacity building and innovation in the Union.
Source: https://www.innovationsfonden.dk/en/p/international-collaborations/chips-ju-chips-europe
Funding Details
- Funder
- Innovation Fund Denmark (Innovationsfonden) / Chips Joint Undertaking (Chips JU)
- Funding Goal
- To support technological capacity building and innovation in the EU's semiconductor ecosystem, strengthening strategic autonomy in electronic components and systems including AI chips, high-performance computing, cybersecurity, and digital infrastructure.
- Funding Amount
- EUR 50,000 minimum; EUR 650,000 per Danish partner (standard); EUR 1,300,000 maximum per project if the coordinator is Danish. National co-funding rates 0-55%. EU co-funding provided separately. (50.000 € – 1.300.000 €)
- Deadline
- 2028-11-20 (Fixed)
- How to Apply
- 1) Submit application to the international call secretariat by the call deadline. 2) Receive e-grant upload invitation approximately 2-4 weeks after the deadline. 3) Upload complete application with all annexes (consortium agreement, budget sheets, Gantt diagram, declarations) via the Danish national e-grant platform. 4) After approval, submit grant acceptance and consortium agreement within approximately 4 weeks. 5) Submit semi-annual progress reports and financial statements (quarterly for SMEs), plus annual auditor reports during the project.
- Target Region
- Denmark / European Union
- Contact
- Asger Narud (Head of International & Missions): +45 6190 5082, asger.narud@innofond.dk. Daniel G. Marques (Advanced technologies + Energy): +45 6190 5006, daniel.g.marques@innofond.dk. General: kontakt@innofond.dk, +45 61 90 50 00.
- Last Checked
- 2026-03-12 05:51
Application Checklist
Eligibility
Project Scope
Required Documents
Constraints
Summary
The Chips for Europe Initiative (CEI) Calls 2025 are administered nationally by Innovation Fund Denmark as part of the EU's Chips Joint Undertaking program. The initiative funds pilot lines, large-scale infrastructures, and targeted innovation in semiconductor technologies including artificial intelligence, high-performance computing, cybersecurity, and digital infrastructure. Three calls were published for 2025: Open-source EDA tools development, Low power Edge AI Chips, and Accelerator for Advanced Strained Silicon on Insulator Substrates. Danish research organizations, Research and Technology Organizations (RTOs), and companies directly involved in project activities are eligible to apply. National co-funding from Innovation Fund Denmark ranges from €50,000 to €650,000 per partner (up to €1,300,000 if the coordinator is Danish), with funding rates between 0-55% of project costs. EU co-funding is provided separately through the Chips JU Work Program. Applicants must contribute their own funds and cannot request 100% financing. The application process involves submitting to the international call secretariat first, then uploading complete applications with annexes via the Danish e-grant platform within 2-4 weeks. Required documents include consortium agreements, budget sheets, Gantt diagrams, and various financial declarations. Two of the three 2025 calls have already closed, with only the Strained Silicon call remaining open until November 2028. The program falls under the EU's Digital Europe and Horizon Europe frameworks.
Historical Context
The Chips JU is the successor to the KDT JU (Key Digital Technologies Joint Undertaking), which ran calls in 2021-2022. The CEI Calls 2025 represent the current round under the Chips JU Work Program 2025. The initiative falls under the EU Chips Act framework for strengthening Europe's semiconductor ecosystem.
Sources
- https://www.innovationsfonden.dk/en/p/international-collaborations/chips-ju-chips-europe
- https://www.chips-ju.europa.eu/calls
- https://www.chips-ju.europa.eu/calls/cei-calls-2025
- https://www.chips-ju.europa.eu/participate
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