Chips JU Global RIA 2026 - Open, Research-Oriented Call
Enriched Nordic · Found: 2026-03-11 08:06
This call addresses aspects of Electronic Components and Systems (ECS) value chain integration, which are important for the Chips JU ...
Source: https://innovationsfonden.dk/en/p/international-collaborations/chips-ju-global-ria-2026
Funding Details
- Funder
- Innovation Fund Denmark (Innovationsfonden) / Chips Joint Undertaking (Chips JU)
- Funding Goal
- Fund collaborative research and innovation in Electronic Components and Systems (ECS) value chain integration, focusing on new knowledge creation, technology feasibility exploration, and small-scale prototype validation.
- Funding Amount
- €50,000 minimum per partner; €650,000 maximum per project (€1,300,000 if Danish coordinator); funding rate 35-90% depending on organization type (50.000 € – 1.300.000 €)
- Deadline
- 2026-05-07 (Fixed)
- How to Apply
- Two-step process: (1) Submit pre-proposal to the international call secretariat (calls@chips-ju.europa.eu) by May 7, 2026. (2) If invited, submit full proposal by September 17, 2026. Danish participants then receive an e-grant invitation within 4 weeks post-deadline to upload required declarations, budget sheets, Gantt diagrams, and the signed Consortia Agreement. Semi-annual progress and financial reports are required post-award, with annual auditor reports mandatory.
- Target Region
- Denmark / European Union
- Contact
- Daniel G. Marques: daniel.g.marques@innofond.dk, +45 6190 5006; Asger Narud (Head): asger.narud@innofond.dk, +45 6190 5082; internationale@innofond.dk; Call secretariat: calls@chips-ju.europa.eu
- Last Checked
- 2026-03-12 05:55
Application Checklist
Eligibility
Project Scope
Required Documents
Constraints
Summary
The Chips JU Global RIA 2026 is an open, research-oriented call under the Chips Joint Undertaking (a European partnership for semiconductors and electronic components). It supports Research and Innovation Actions (RIAs) aimed at establishing new knowledge and exploring the feasibility of new or improved technologies, products, or processes in the Electronic Components and Systems (ECS) domain. Activities include applied research, technology development, and small-scale prototype validation. Danish participants apply through Innovation Fund Denmark for national co-funding. Eligible applicants include Danish universities, companies, industry organizations, research and technology organizations (RTOs), and research institutions that are directly involved in project activities. The call follows a two-step process: a pre-proposal deadline on May 7, 2026, followed by a full proposal deadline on September 17, 2026 for invited applicants. National co-funding from Innovation Fund Denmark is capped at €650,000 per project (or €1,300,000 if the coordinator is Danish), with a minimum of €50,000 per partner. Funding rates range from 35% to 90% depending on the type of organization. The program requires participation in international consortia and submission of various declarations and budget documents through the e-grant platform.
Historical Context
This is part of the Chips JU Work Programme 2026 calls. The Chips Joint Undertaking is a European partnership for semiconductors. Innovation Fund Denmark provides national co-funding guidelines updated periodically (versions from July 2024 and March 2025 referenced).
Sources
- https://innovationsfonden.dk/en/p/international-collaborations/chips-ju-global-ria-2026
- https://www.chips-ju.europa.eu/calls/chips-ju-2026-2-ria
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